Sputtering Targets Bonding

Bonding
An effective method to join a target to a backing plate is using an In or InSn solder bond. Combined with the proper target/backing plate preparation, Heraeus produces structurally sound bonds over a wide range of sizes and materials. Every bond integrity is verified using ultrasonic test equipment. As an alternative to metal solder bonds, Heraeus also supplies Epoxy bonds with higher strength and power density, offset by lower thermal/electrical conductivity.